Semiconductors and Electronics

Surface Mount Technology Market with Key Competitors like ASM Assembly Systems GmbH & Co. KG, YXLON International, Viscom AG, Universal Instruments Corporation, Teradyne Inc. and Many More

Global surface mount technology market is to register a Substantial CAGR of 8.86 %in the forecast period of 2019-2026. The report contains data from the base year of 2018 and the historic year of 2017. The rise in the market value can be attributed to the increase in supply for electronic products to miniaturized consumers.

Few of the major competitors currently working in the Global surface mount technology market are ASM Assembly Systems GmbH & Co. KG, YXLON International, Viscom AG, Universal Instruments Corporation, Teradyne Inc., Saki Corporation., Panasonic Corporation, Orbotech Ltd., OMRON Corporation, Nordson Corporation, Nikon Metrology Inc., Naprotek, Inc., Mycronic, Kulicke & Soffa Industries, Inc., KOHYOUNG TECHNOLOGY inc,  JUKI CORPORATION., Illinois Tool Works Inc., GLENBROOK TECHNOLOGIES, FUJI Corporation, Electro Scientific Industries, Inc, Yamaha Motor Co., Ltd. amongst others.

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Market Restraints:

  • High capital cost of units produced set-up equipment is hampering the growth of the market
  • Higher frequency and thermal dissipation requirements is hindering the growth of the market
  • Surface mounting technology is inadequate for elevated-power or heavy-voltage components such as power circuits

Surface mounting (SMT) technology is a technique of generating electronic circuits where the parts are installed or put straight on the printed circuit board (PCB). An electronic device thereby generated is a surface mount device (SMD).It has mainly substituted the technique of connecting parts with cable leads in the circuit board through-hole technique design in the sector. Both technologies, such as huge transformers and heat sinked power semiconductors, can be used in the same board for components not suitable for surface mounting.

Table of Contents

  1. Introduction
  2. Market Segmentation
  3. Market Overview
  4. Executive Summary
  5. Premium Insights
  6. Global, By Component
  7. Product Type
  8. Delivery
  9. Industry Type
  10. Geography

10.1. Overview

10.2. North America

10.3. Europe

10.4. Asia-Pacific

10.5. South America

10.6. Middle East & Africa

  1. Company Landscape
  2. Company Profiles
  3. Related Reports

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Market Drivers:

  • Increase in supply for electronic products to miniaturized consumers is propelling the growth of the market
  • Growing demand of  electric vehicle adoption is driving the growth of the market
  • SMT parts are less costly than through-hole parts which is boosting the growth of the market .SMT benefits like automated production, enhancing output and effectiveness in manufacturing is contributing to the growth of the market

 Key Developments in the Market

  • In January 2019, Teradyne, Inc. announced the takeover of Lemsys, a privately held company. Lemsys is the world’s major supplier in the high-power semiconductor industry, servicing the evolving and increasing market of separate devices and modules for, wind and solar power generation, electric vehicles, and heavy-power manufacturing application. With this acquisition with Teradyne expand the range of test solutions to power semiconductor customers
  • In January 2017, Saki Corp. has recently launched a fresh facility in Chiba, Japan, to increase the manufacturing of its automated inspection and assessment devices. The newly refurbished plant expanded monitoring of the installation of smartphones, communications systems, and automotive electronics to improve the performance and remove device failure which created a higher requirement for the inspection system.

Global Surface Mount Technology Market Segmentation: 

By Component (Qualitative)

  • Passive Surface-Mount Devices
    • Resistor
    • Capacitor
  • Transistor & Diodes
  • Integrated Circuits

By Service (Qualitative)

  • Design
  • Test and Prototype
  • Supply Chain Services
  • Manufacturing
  • Aftermarket Services

By Equipment

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